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Hall IC Series
Unipolar Detection Hall ICs
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
No.10045EBT03
Description The unipolar Detection Hall IC detects only either the N pole or S pole. The output turns ON (active Low) upon detection. It is most suitable for strictly unipole detection and when lower power consumption is desired. Features 1) unipolar detection 2) Micropower operation (small current using intermittent operation method) 3) Ultra-compact CSP4 package (BU52002GUL,BU52003GUL) 4) Small outline package (BU52012HFV,BU52013HFV) 5) Line up of supply voltage For 1.8V Power supply voltage(BU52012HFV,BU52013HFV) For 3.0V Power supply voltage (BU52002GUL,BU52003GUL) 6) High ESD resistance 8kV(HBM) Applications Mobile phones, notebook computers, digital video camera, digital still camera, etc. Product Lineup Product name BU52002GUL BU52003GUL BU52012HFV BU52013HFV Supply voltage Operate point (V) (mT) 2.403.30 3.7 2.403.30 -3.7 1.653.30 3.0 1.653.30 -3.0 Hysteresis (mT) 0.8 0.8 0.9 0.9 Period (ms) 50 50 50 50 Supply current (AVG.)(A) 6.5 6.5 3.5 3.5 Output type CMOS CMOS CMOS CMOS Package VCSP50L1 VCSP50L1 HVSOF5 HVSOF5
Plus is expressed on the S-pole; minus on the N-pole
Absolute Maximum Ratings BU52002GUL,BU52003GUL (Ta=25) Parameters Power Supply Voltage Output Current Power Dissipation Operating Temperature Range Storage Temperature Range Symbol VDD IOUT Pd Topr Tstg Limit -0.1+4.5 1 2 420 -40+85 -40+125
1
Unit V mA mW
1. Not to exceed Pd 2. Reduced by 4.20mW for each increase in Ta of 1 over 25(mounted on 50mmx58mm Glass-epoxy PCB)
BU52012HFV,BU52013HFV (Ta=25) Parameters Power Supply Voltage Output Current Power Dissipation Operating Temperature Range Storage Temperature Range Symbol VDD IOUT Pd Topr Tstg Limit -0.1+4.53 0.5 5364 -40+85 -40+125 Unit V mA mW
3. Not to exceed Pd 4. Reduced by 5.36mW for each increase in Ta of 1 over 25(mounted on 70mmx70mmx1.6mm Glass-epoxy PCB)
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1/13
2010.01 - Rev.B
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
Magnetic, Electrical Characteristics BU52002GUL (Unless otherwise specified, VDD3.0V, Ta25) Parameters Power Supply Voltage Operate Point Release Point Hysteresis Period Output High Volage Output Low Voltage Supply Current Supply Current During Startup Time Supply Current During Standby Time Symbol VDD BopS BrpS BhysS TP VOH VOL IDD(AVG) IDD(EN) IDD(DIS) Min 2.4 0.8 VDD-0.4 Limit Typ 3.0 3.7 2.9 0.8 50 6.5 4.7 3.8 Max 3.3 5.5 100 0.4 9 Unit V mT mT mT ms V V A mA A
Technical Note
Conditions
B5. B = Magnetic flux density 1mT=10Gauss Positive ("+") polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed.
BU52003GUL (Unless otherwise specified, VDD3.0V, Ta25) Limit Parameters Symbol Min Typ Power Supply Voltage Operate Point Release Point Hysteresis Period Output High Volage Output Low Voltage Supply Current Supply Current During Startup Time Supply Current During Standby Time VDD BopN BrpN BhysN TP VOH VOL IDD(AVG) IDD(EN) IDD(DIS) 2.4 -5.5 VDD-0.4 3.0 -3.7 -2.9 0.8 50 6.5 4.7 3.8
Max 3.3 -0.8 100 0.4 9 -
Unit V mT mT mT ms V V A mA A
Conditions
BrpN6. B = Magnetic flux density 1mT=10Gauss Positive ("+") polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed.
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2/13
2010.01 - Rev.B
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
Technical Note
BU52012HFV (Unless otherwise specified, VDD1.80V, Ta25) Limit Parameters Symbol Min Typ Power Supply Voltage Operate Point Release Point Hysteresis Period Output High Volage Output Low Voltage Supply Current 1 Supply Current During Startup Time 1 Supply CurrentDuring Standby Time 1 Supply Current 2 Supply Current During Startup Time 2 Supply CurrentDuring Standby Time 2 VDD BopS BrpS BhysS TP VOH VOL IDD1(AVG) IDD1(EN) IDD1(DIS) IDD2(AVG) IDD2(EN) IDD2(DIS) 1.65 0.6 VDD-0.2 1.80 3.0 2.1 0.9 50 3.5 2.8 1.8 6.5 4.5 4.0
Max 3.30 5.0 100 0.2 5.5 9 -
Unit V mT mT mT ms V V A mA A A mA A
Conditions
B6. B = Magnetic flux density 1mT=10Gauss Positive ("+") polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed.
BU52013HFV (Unless otherwise specified, VDD1.80V, Ta25) Limit Parameters Symbol Min Typ Power Supply Voltage Operate Point Release Point Hysteresis Period Output High Voltage Output Low Voltage Supply Current 1 Supply Current During Startup Time 1 Supply CurrentDuring Standby Time 1 Supply Current 2 Supply Current During Startup Time 2 Supply CurrentDuring Standby Time 2 VDD BopN BrpN BhysN TP VOH VOL IDD1(AVG) IDD1(EN) IDD1(DIS) IDD2(AVG) IDD2(EN) IDD2(DIS) 1.65 -5.0 VDD-0.2 1.80 -3.0 -2.1 0.9 50 3.5 2.8 1.8 6.5 4.5 4.0
Max 3.30 -0.6 100 0.2 5.5 9 -
Unit V mT mT mT ms V V A mA A A mA A
Conditions
BrpN7 B = Magnetic flux density 1mT=10Gauss Positive ("+") polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed.
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3/13
2010.01 - Rev.B
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
Figure of mesurement circuit Bop/Brp Tp
200
Technical Note
VDD VDD
VDD VDD OUT Oscilloscope V GND OUT
100F
GND
Bop and Brp are measured with applying the magnetic field from the outside.
The period is monitored by Oscilloscope.
Fig.1
Bop,Brp mesurement circuit
Fig.2
Tp mesurement circuit
VOH
Product Name BU52002GUL, BU52003GUL
VDD
IOUT 1.0mA 0.5mA
VDD
BU52012HFV, BU52013HFV
IOUT
100F
GND
OUT V
Fig.3
VOH mesurement circuit
VOL
Product Name BU52002GUL, BU52003GUL
VDD
IOUT 1.0mA 0.5mA
BU52012HFV, BU52013HFV
OUT
VDD
100F
GND
V
IOUT
Fig.4
VOL mesurement circuit
IDD
A 2200F VDD OUT GND
VDD
Fig.5
IDD mesurement circuit
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4/13
2010.01 - Rev.B
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
Technical (Reference) Data BU52002GUL (VDD=2.43.3V type)
8.0 MAGNETIC FLUX DENSITY [mT]
MAGNETIC FLUX DENSITY [mT]
Technical Note
8.0 VDD=3.0V Bop S 6.0 4.0 2.0 0.0 -2.0 -4.0 -6.0 -8.0
2.0 2.4 2.8 3.2 3.6
PERIOD [ms]
100
6.0 4.0 2.0 0.0 -2.0 -4.0 -6.0 -8.0
Ta = 25C
90
Bop S
80 70 60 50 40 30 20 10 0
VDD=3.0V
Brp S
Brp S
-60 -40 -20 0
20 40 60 80 100
AMBIENT TEMPERATURE []
SUPPLY VOLTAGE V
-60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE []
Fig.6
100 90 80 PERIOD [ms] 70 60 50 40 30 20 10 0
Bop,Brp - Ambient temperature
Fig.7
20.0 18.0 16.0 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0
Bop,Brp - Supply voltage
Fig.8 TP -Ambient temperature
20.0 18.0 16.0 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 2.0 2.4 2.8 3.2 3.6 SUPPLY VOLTAGE [V]
Ta = 25C
AVERAGE SUPPLY CURRENT [A]
Ta = 25C
VDD=3.0V
2.0
2.4
2.8
3.2
3.6
-60 -40 -20 0
20 40 60 80 100
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE []
AVERAGE SUPPLY CURRENT [A]
Fig.9 TP - Supply voltage
Fig.10 IDD - Ambient temperature
Fig.11 IDD - Supply voltage
BU52003GUL (VDD=2.43.3V type)
8.0 MAGNETIC FLUX DENSITY [mT]
8.0 MAGNETIC FLUX DENSITY [mT] 6.0 4.0 2.0 0.0 -2.0 -4.0 -6.0 -8.0 2.0 2.4 2.8 3.2 3.6 SUPPLY VOLTAGE V
PERIOD [ms]
100 90
6.0 4.0 2.0 0.0 -2.0 -4.0 -6.0 -8.0 -60 -40 -20 0 20 40 60 80 100
VDD=3.0V
Ta = 25C
80 70 60 50 40 30 20 10 0
VDD=3.0V
Brp N
Brp N
Bop N
Bop N
-60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE []
AMBIENT TEMPERATURE []
Fig.12 Bop,Brp - Ambient temperature
Fig.13 Bop,Brp - Supply voltage
Fig.14 TP - Ambient temperature
90 80 PERIOD [ms] 70 60 50 40 30 20 10 0 2.0
Ta = 25C
18.0 16.0 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0
AVERAGE SUPPLY CURRENT [A]
AVERAGE SUPPLY CURRENT [A]
100
20.0
20.0 18.0 16.0 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 2.0 2.4 2.8 3.2 SUPPLY VOLTAGE [V] 3.6
Ta = 25C
VDD=3.0V
2.4 2.8 3.2 SUPPLY VOLTAGE [V]
3.6
-60 -40 -20 0
20 40 60 80 100
AMBIENT TEMPERATURE []
Fig.15 TP -Supply voltage
Fig.16 IDD - Ambient temperature
Fig.17 IDD - Supply voltage
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5/13
2010.01 - Rev.B
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
BU52012HFV (VDD=1.65V3.3V type)
Technical Note
MAGNETIC FLUX DENSITY [mT]
MAGNETIC FLUX DENSITY [mT]
8.0 6.0 4.0 2.0 0.0 -2.0 -4.0 -6.0 -8.0 -60 -40 -20 0 20 40 60 80 100
Brp S VDD=1.8V Bop S
8.0 6.0 4.0 2.0 0.0 -2.0 -4.0 -6.0 -8.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 SUPPLY VOLTAGE V Brp S
PERIOD [ms]
100
Ta = 25C
90
Bop S
80 70 60 50 40 30 20 10 0
VDD=1.8V
-60 -40 -20 0
20 40 60 80 100
AMBIENT TEMPERATURE []
AMBIENT TEMPERATURE []
Fig.18 Bop,Brp - Ambient temperature
Fig.19 Bop,Brp - Supply voltage
Fig.20 TP - Ambient temperature
AVERAGE SUPPLY CURRENT [A]
90 80 70 PERIOD [ms] 60 50 40 30 20 10 0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 SUPPLY VOLT AGE [V]
Ta = 25C
18.0 16.0 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0
AVERAGE SUPPLY CURRENT [A]
100
20.0
VDD=1.8V
20.0 18.0 16.0 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 SUPPLY VOLTAGE [V]
Ta = 25C
-60 -40 -20 0
20 40 60 80 100
AMBIENT TEMPERATURE []
Fig.21 TP - Supply voltage BU52013HFV (VDD=1.65V3.3V type)
MAGNETIC FLUX DENSITY [mT] 8.0
Fig.22 IDD - Ambient temperature
Fig.23 IDD - Supply voltage
8.0 MAGNETIC FLUX DENSITY [mT]
100
6.0 4.0 2.0 0.0 -2.0 -4.0 -6.0 -8.0
VDD=1.8V
6.0 4.0 2.0 0.0 -2.0 -4.0 -6.0 -8.0 1.4
Ta = 25C
90 80 PERIOD [ms] 70 60 50 40 30 20 10 0
VDD=1.8V
Brp N
Brp N
Bop N
Bop N
-60 -40 -20 0
20 40 60 80 100
1.8
2.2
2.6
3.0
3.4
3.8
AMBIENT TEMPERATURE []
SUPPLY VOLTAGE V
-60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE []
Fig.24 Bop,Brp - Ambient temperature
Fig.25 Bop,Brp - Supply voltage
Fig.26 TP - Ambient temperature
90 80 PERIOD [ms] 70 60 50 40 30 20 10 0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 SUPPLY VOLTAGE [V]
18.0 16.0 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0
AVERAGE SUPPLY CURRENT [A]
AVERAGE SUPPLY CURRENT [A]
100
20.0
20.0 18.0 16.0 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 SUPPLY VOLTAGE [V]
Ta = 25C
VDD=1.8V
Ta = 25C
-60 -40 -20 0
20 40 60 80 100
AMBIENT TEMPERATURE []
Fig.27 TP - Supply voltage
Fig.28 IDD - Ambient temperature
Fig.29 IDD - Supply voltage
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6/13
2010.01 - Rev.B
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
Block Diagram BU52002GUL, BU52003GUL
0.1F VDD
A1
Technical Note
TIMING LOGIC DYNAMIC OFFSET CANCELLATION HALL ELEMENT
Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc.
SAMPLE & HOLD
x
LATCH
B1
OUT
The CMOS output terminals enable direct connection to the PC, with no external pull-up resistor required.
A2
GND
Fig.30 PIN No. A1 A2 B1 B2 PIN Name VDD GND OUT N.C. Function POWER SUPPLY GROUND OUTPUT OPEN or Short to GND. B1 B2 B2 B1 Comment A1 A2 A2 A1
Surface BU52012HFV, BU52013HFV
DD
4
Reverse
0.1F Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. The CMOS output terminals enable direct connection to the PC, with no external pull-up resistor required
5
TIMING LOGIC DYNAMIC OFFSET CANCELLATION HALL ELEMENT
SAMPLE & HOLD
x
LATCH
OUT
2
GND
Fig.31 PIN No. 1 2 3 4 5 PIN NAME N.C. GND N.C. VDD OUT POWER SUPPLY OUTPUT GROUND OPEN or Short to GND. 1 2 Surface 3 3 2 1 Reverse FUNCTION COMMENT OPEN or Short to GND. 5 4 4 5
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7/13
2010.01 - Rev.B
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
Description of Operations (Micropower Operation) IDD Period Startup time Standby
Technical Note
The unipolar detection Hall IC adopts an intermittent operation method to save energy. At startup, the Hall elements, amp, comparator and other detection circuits power ON and magnetic detection begins. During standby, the detection circuits power OFF, thereby reducing current consumption. The detection results are held while standby is active, and then output.
Fig.32 (Offset Cancelation) VDD I
t Reference period: 50ms (MAX100ms) Reference startup time: 24s
Bx
Hall Voltage
GND Fig.33
The Hall elements form an equivalent Wheatstone (resistor) bridge circuit. Offset voltage may be generated by a differential in this bridge resistance, or can arise from changes in resistance due to package or bonding stress. A dynamic offset cancellation circuit is employed to cancel this offset voltage. When Hall elements are connected as shown in Fig. 33 and a magnetic field is applied perpendicular to the Hall elements, voltage is generated at the mid-point terminal of the bridge. This is known as Hall voltage. Dynamic cancellation switches the wiring (shown in the figure) to redirect the current flow to a 90 angle from its original path, and thereby cancels the Hall voltage. The magnetic signal (only) is maintained in the sample/hold circuit during the offset cancellation process and then released.
(Magnetic Field Detection Mechanism)
S S S N S N
N
Flux
Flux
Fig.34 The Hall IC cannot detect magnetic fields that run horizontal to the package top layer. Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer.
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8/13
2010.01 - Rev.B
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
BU52002GUL,BU52012HFV
S-Pole
Technical Note
S S N OUT [V]
N N S
High
Flux
Flux High High Low B Brp S Bop S 0 Magnetic flux density [mT] Fig.35 S-Pole Detection
N-Pole
S-Pole
BU52002GUL,BU52012HFV detects and outputs for the S-pole only. Since it is unipolar, it does not recognize the N-pole. BU52003GUL,BU52013HFV
N-Pole
S S N OUT [V] Flux High Low
N N S
Flux High High
B Bop N Brp N 0 Magnetic flux density [mT] Fig.36 N-Pole Detection
S-Pole N-Pole
BU52003GUL,BU52013HFV detects and outputs for the N-pole only. Since it is unipolar, it does not recognize the S-pole. The unipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of the package. There is an inverse relationship between magnetic flux density and the distance separating the magnet and the Hall IC: when distance increases magnetic density falls. When it drops below the operate point (Bop), output goes HIGH. When the magnet gets closer to the IC and magnetic density rises, to the operate point, the output switches LOW. In LOW output mode, the distance from the magnet to the IC increases again until the magnetic density falls to a point just below Bop, and output returns HIGH. (This point, where magnetic flux density restores HIGH output, is known as the release point, Brp.) This detection and adjustment mechanism is designed to prevent noise, oscillation and other erratic system operation.
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9/13
2010.01 - Rev.B
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
Intermittent Operation at Power ON Power ON
Technical Note
VDD Startup time
Supply current (Intermittentaction)
Standby time
Startup time
Standby time
OUT
(No magnetic field present)
Indefinite
High
OUT
(Magnetic field present)
Indefinite
Low Fig.37
The unipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during startup, as shown in Fig. 37. It outputs to the appropriate terminal based on the detection result and maintains the output condition during the standby period. The time from power ON until the end of the initial startup period is an indefinite interval, but it cannot exceed the maximum period, 100ms. To accommodate the system design, the Hall IC output read should be programmed within 100ms of power ON, but after the time allowed for the period ambient temperature and supply voltage. Magnet Selection Of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume than ferrite, thereby enabling the highest degree of miniaturization, Thus, neodymium is best suited for small equipment applications. Fig. 38 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. The graph plots the correlation between the distance (L) from three versions of a 4mm X 4mm cross-section neodymium magnet (1mm, 2mm, and 3mm thick) and magnetic flux density. Fig. 39 shows Hall IC detection distance - a good guide for determining the proper size and detection distance of the magnet. Based on the BU52012HFV,BU52013HFV operating point max 5.0 mT, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 7.6mm, 9.22mm, and 10.4mm, respectively. To increase the magnet's detection distance, either increase its thickness or sectional area.
10 9 Magnetic flux density[mT] 8 7 6 5 4 3 2 1 0 0 2 4 6
7.6mm 9.2mm 10.4mm
t=3mm t=1mm t=2mm
8
10
Fig.38
12
14
16
18
20
Distance between magnet and Hall IC [mm]
X Y
t X=Y=4mm t=1mm,2mm,3mm Magnet size
Magnet
Magnet material: NEOMAX-44H (material) Maker: NEOMAX CO.,LTD. t
L: Variable ...Flux density measuring point
Fig.39 Magnet Dimensions and Flux Density Measuring Point
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10/13
2010.01 - Rev.B
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
Position of the Hall Effect IC(Reference) VCSP50L1
0.55 0.55
Technical Note
HVSOF5
0.6 0.8
0.35
0.2
(UNITmm)
Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition) VCSP50L1 HVSOF5
(UNITmm)
Strings e b3 SD SE
Size(Typ.) 0.50 0.25 0.25 0.25
Terminal Equivalent Circuit Diagram Because they are configured for CMOS (inverter) output, the output pins require no external resistance and allow direct connection to the PC. This, in turn, enables reduction of the current that would otherwise flow to the external resistor during magnetic field detection, and supports overall low current (micropower) operation. OUT VDD
GND Fig.40
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11/13
2010.01 - Rev.B
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
Technical Note
Notes for use 1) Absolute maximum ratings Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in excess of absolute rating limits. 2) GND voltage Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower than the potential of all other pins. 3) Thermal design Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning or orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted together, or if shorts occur between the output pin and supply pin or GND. 5) Positioning components in proximity to the Hall IC and magnet Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore the magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in the design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design. 6) Operation in strong electromagnetic fields Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause the IC to malfunction. 7) Common impedance Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example, employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or capacitor. 8) GND wiring pattern When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same way, care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components. 9) Exposure to strong light Exposure to halogen lamps, UV and other strong light sources may cause the IC to malfunction. If the IC is subject to such exposure, provide a shield or take other measures to protect it from the light. In testing, exposure to white LED and fluorescent light sources was shown to have no significant effect on the IC. 10) Power source design Since the IC performs intermittent operation, it has peak current when it's ON. Please taking that into account and under examine adequate evaluations when designing the power source.
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12/13
2010.01 - Rev.B
BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV
Ordering part number
Technical Note
B
Part No
U
5
2
0
0
2
G
U
L
-
E
2
Part No 52002,52003, 52012,52013
Package GUL : VSCP50L1 HFV : HVSOF5
Packaging and forming specification E2: Embossed tape and reel (VSCP50L1) TR: Embossed tape and reel (HVSOF5)
VCSP50L1 (BU52002GUL,BU52003GUL)

Tape Quantity Direction of feed Embossed carrier tape 3000pcs E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
(Unit:mm)
1pin Reel
Direction of feed
Order quantity needs to be multiple of the minimum quantity.
HVSOF5

1.60.05 (0.8)
0.2MAX
Tape Quantity Direction of feed
Embossed carrier tape 3000pcs TR
The direction is the 1pin of product is at the upper right when you hold
1.20.05 (MAX 1.28 include BURR)
1.00.05
(0.05)
(0.3)
1.60.05
5
4
4
5
(0.91)
(0.41)
( reel on the left hand and you pull out the tape on the right hand
1pin
)
123
321
0.130.05 S
0.6MAX
+0.03 0.02 -0.02
0.1 0.5 0.220.05
S 0.08
M
Direction of feed
(Unit : mm)
Reel
Order quantity needs to be multiple of the minimum quantity.
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13/13
2010.01 - Rev.B
Notice
Notes
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R1010A

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